Invention Grant
- Patent Title: Bonding structure of circuit substrate and instant circuit inspection method thereof
- Patent Title (中): 电路基板的接合结构及其即时电路检测方法
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Application No.: US11905439Application Date: 2007-10-01
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Publication No.: US07919782B2Publication Date: 2011-04-05
- Inventor: Ming-Tan Hsu , I-Cheng Shih
- Applicant: Ming-Tan Hsu , I-Cheng Shih
- Applicant Address: TW Padeh, Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Padeh, Taoyuan
- Agent Winston Hsu; Scott Margo
- Priority: TW95148472A 20061222
- Main IPC: H01L29/20
- IPC: H01L29/20
Abstract:
The present invention provides a bonding structure of circuit substrates and an instant circuit inspection method thereof. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.
Public/Granted literature
- US20080149947A1 Bonding structure of circuit substrate and instant circuit inspection method thereof Public/Granted day:2008-06-26
Information query
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