Invention Grant
- Patent Title: Assembly of a heat dissipating base and a lead frame for a light emitting diode packaging device and method for making the same
- Patent Title (中): 用于发光二极管封装装置的散热基座和引线框架的组装及其制造方法
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Application No.: US11984339Application Date: 2007-11-16
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Publication No.: US07919788B2Publication Date: 2011-04-05
- Inventor: Chia-Hao Wu , Chen-Hsiu Lin
- Applicant: Chia-Hao Wu , Chen-Hsiu Lin
- Applicant Address: TW Taipei
- Assignee: Lite-On Technology Corp.
- Current Assignee: Lite-On Technology Corp.
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: TW96135413A 20070921
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting diode packaging device includes: a heat dissipating base; a light emitting dice mounted on the heat dissipating base; a lead frame coupled electrically to the light emitting dice and having a protruding wall defining a confining space for extension of a protruding part of the heat dissipating base therethrough; at least one retaining member provided on one of the protruding part of the heat dissipating base and the protruding wall of the lead frame to retain the lead frame to the heat dissipating base; and a molding material molded on the heat dissipating base and the lead frame.
Public/Granted literature
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