Invention Grant
US07919791B2 Doped group III-V nitride materials, and microelectronic devices and device precursor structures comprising same 有权
掺杂的III-V族氮化物材料,以及包含它们的微电子器件和器件前体结构

  • Patent Title: Doped group III-V nitride materials, and microelectronic devices and device precursor structures comprising same
  • Patent Title (中): 掺杂的III-V族氮化物材料,以及包含它们的微电子器件和器件前体结构
  • Application No.: US10107001
    Application Date: 2002-03-25
  • Publication No.: US07919791B2
    Publication Date: 2011-04-05
  • Inventor: Jeffrey S. FlynnGeorge R. Brandes
  • Applicant: Jeffrey S. FlynnGeorge R. Brandes
  • Applicant Address: US NC Durham
  • Assignee: Cree, Inc.
  • Current Assignee: Cree, Inc.
  • Current Assignee Address: US NC Durham
  • Agency: Hultquist IP
  • Agent Vincent K. Gustafson
  • Main IPC: H01L29/778
  • IPC: H01L29/778
Doped group III-V nitride materials, and microelectronic devices and device precursor structures comprising same
Abstract:
A Group III-V nitride microelectronic device structure including a delta doped layer and/or a doped superlattice. A delta doping method is described, including the steps of: depositing semiconductor material on a substrate by a first epitaxial film growth process; terminating the deposition of semiconductor material on the substrate to present an epitaxial film surface; delta doping the semiconductor material at the epitaxial film surface, to form a delta doping layer thereon; terminating the delta doping; resuming deposition of semiconductor material to deposit semiconductor material on the delta doping layer, in a second epitaxial film growth process; and continuing the semiconductor material second epitaxial film growth process to a predetermined extent, to form a doped microelectronic device structure, wherein the delta doping layer is internalized in semiconductor material deposited in the first and second epitaxial film growth processes.
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/778 .....带有二维载流子气沟道的,如HEMT
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