Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US12588938Application Date: 2009-11-03
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Publication No.: US07919793B2Publication Date: 2011-04-05
- Inventor: Shusuke Iwata
- Applicant: Shusuke Iwata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2009-012955 20090123
- Main IPC: H01L27/10
- IPC: H01L27/10 ; G06F17/50

Abstract:
Disclosed herein is a semiconductor integrated circuit including: a plurality of standard cells including a transistor having a gate electrode and arranged in combination with each other; a metallic wiring layer interconnecting the standard cells to form a desired circuit; and a plurality of reserve cells having a gate electrode, unconnected with the metallic wiring layer and arranged on a periphery of the standard cells, wherein each of the gate electrodes of the standard cells and the reserve cells has a gate pad section and two gate finger sections extending from the gate pad section to sides opposite to each other in a predetermined direction, and length of the gate pad sections of the reserve cells in a direction orthogonal to the predetermined direction is equal to or more than a sum total value of three times a minimum line width in the metallic wiring layer and twice a minimum separation distance.
Public/Granted literature
- US20100187573A1 Semiconductor integrated circuit Public/Granted day:2010-07-29
Information query
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