Method and structure for ballast resistor

Invention Grant

US07919830B2 Method and structure for ballast resistor 有权

Title translation: 镇流电阻的方法和结构

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Patent Title: Method and structure for ballast resistor
Patent Title (中): 镇流电阻的方法和结构
Application No.: US12062262

Application Date: 2008-04-03
Publication No.: US07919830B2

Publication Date: 2011-04-05
Inventor: Douglas D. Coolbaugh , Ebenezer E. Eshun , Zhong-Xiang He , Robert M. Rassel , Kimball M. Watson
Applicant: Douglas D. Coolbaugh , Ebenezer E. Eshun , Zhong-Xiang He , Robert M. Rassel , Kimball M. Watson
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: King & Spalding LLP
Main IPC: H01L21/8222
IPC: H01L21/8222

Method and structure for ballast resistor

Abstract:

A method for fabricating a low-value resistor such as a ballast resistor for bipolar junction transistors. The resistor may be fabricated using layers of appropriate sheet resistance so as to achieve low resistance values in a compact layout. The method may rely on layers already provided by a conventional CMOS process flow, such as contact plugs and fully silicided (FUSI) metal gates.

Abstract(Chinese):

一种用于制造低电阻电阻器的方法，例如用于双极结型晶体管的镇流电阻器。可以使用适当的薄层电阻的层来制造电阻器，以便在紧凑的布局中实现低电阻值。该方法可以依赖于传统CMOS工艺流程已经提供的层，例如接触插塞和完全硅化（FUSI）金属栅极。

Public/Granted literature

US20090253239A1 METHOD AND STRUCTURE FOR BALLAST RESISTOR Public/Granted day:2009-10-08

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8222	......双极工艺