Invention Grant
- Patent Title: Integrated non-isolated VRM and microprocessor assembly
- Patent Title (中): 集成非隔离式VRM和微处理器组合
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Application No.: US11942927Application Date: 2007-11-20
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Publication No.: US07919840B2Publication Date: 2011-04-05
- Inventor: Randhir S. Malik
- Applicant: Randhir S. Malik
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Cynthia S. Seal
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
The present invention provides one single chip solution for a non-isolated DC-DC regulator. The advantage is high reliability, lower cost and smaller space on the motherboard. This integrated solution opens the door for a distributed architecture with few millimeter high 1″×1″ regulator. Such regulators could be populated as QFP ICs are on all system boards. The present invention is based on a single VRM chip, PBGA multilayer board with processor signal pads and power points. The multilayer board periphery has SMD components such as ceramic capacitors, ICs, MOSFETs and a rectangular metal heat sink along with ferrite cores which sandwich the multilayer board and SMDs to form inductors for the multiphase solution.
Public/Granted literature
- US20090129027A1 INTEGRATED NON-ISOLATED VRM AND MICROPROCESSOR ASSEMBLY Public/Granted day:2009-05-21
Information query
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