Invention Grant
- Patent Title: Mounting structures for integrated circuit modules
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Application No.: US12010138Application Date: 2008-01-22
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Publication No.: US07919841B2Publication Date: 2011-04-05
- Inventor: Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
- Applicant: Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0007720 20070125
- Main IPC: H01L23/02
- IPC: H01L23/02

Abstract:
A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
Public/Granted literature
- US20080179649A1 Mounting structures for integrated circuit modules Public/Granted day:2008-07-31
Information query
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