Invention Grant
- Patent Title: Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof
- Patent Title (中): 具有外露端子互连的集成电路封装系统及其制造方法
-
Application No.: US12331416Application Date: 2008-12-09
-
Publication No.: US07919850B2Publication Date: 2011-04-05
- Inventor: Arnel Senosa Trasporto , Lionel Chien Hui Tay , Zigmund Ramirez Camacho , Abelardo Hadap Advincula, Jr.
- Applicant: Arnel Senosa Trasporto , Lionel Chien Hui Tay , Zigmund Ramirez Camacho , Abelardo Hadap Advincula, Jr.
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/02
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.
Public/Granted literature
Information query
IPC分类:
