Invention Grant
- Patent Title: Semiconductor module with two cooling surfaces and method
- Patent Title (中): 半导体模块具有两个冷却面和方法
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Application No.: US12192496Application Date: 2008-08-15
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Publication No.: US07919854B2Publication Date: 2011-04-05
- Inventor: Thilo Stolze
- Applicant: Thilo Stolze
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billiq & Czaja, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.
Public/Granted literature
- US20100038758A1 SEMICONDUCTOR MODULE WITH TWO COOLING SURFACES AND METHOD Public/Granted day:2010-02-18
Information query
IPC分类:
