Invention Grant
- Patent Title: Plastic housing and semiconductor component with said plastic housing
- Patent Title (中): 塑料外壳和半导体元件与塑料外壳
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Application No.: US11867132Application Date: 2007-10-04
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Publication No.: US07919857B2Publication Date: 2011-04-05
- Inventor: Michael Bauer , Peter Strobel , Jens Pohl , Christian Stuempfl , Ludwig Heitzer
- Applicant: Michael Bauer , Peter Strobel , Jens Pohl , Christian Stuempfl , Ludwig Heitzer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102005015455 20050404
- Main IPC: H01L23/06
- IPC: H01L23/06 ; H01L23/552 ; H01L21/00
Abstract:
A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.
Public/Granted literature
- US20080045063A1 Plastic Housing and Semiconductor Component with Said Plastic Housing and Method for Producing the Same Public/Granted day:2008-02-21
Information query
IPC分类:
