Invention Grant
US07919869B2 Semiconductor device and method of visual inspection and apparatus for visual inspection 失效
目视检查用半导体装置及方法,目视检查装置

  • Patent Title: Semiconductor device and method of visual inspection and apparatus for visual inspection
  • Patent Title (中): 目视检查用半导体装置及方法,目视检查装置
  • Application No.: US12040950
    Application Date: 2008-03-03
  • Publication No.: US07919869B2
    Publication Date: 2011-04-05
  • Inventor: Hokuto Kumagai
  • Applicant: Hokuto Kumagai
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Young & Thompson
  • Priority: JP2007-051704 20070301
  • Main IPC: H01L23/48
  • IPC: H01L23/48
Semiconductor device and method of visual inspection and apparatus for visual inspection
Abstract:
A semiconductor device having the structure, which is adopted for the highly precise visual inspection with a lower cost, is achieved. A semiconductor device is a semiconductor device having a region for forming an electric circuit, and includes seal rings provided in an interconnect layer and surrounding the region for forming an electric circuit, and a dummy metal via provided in the interconnect layer and located outside of the seal rings. In a cross section perpendicular to an elongating direction of the seal ring, the width of the dummy metal via is smaller than the width of the seal ring.
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