Invention Grant
US07919872B2 Integrated circuit (IC) carrier assembly with first and second suspension means
失效
具有第一和第二悬挂装置的集成电路（IC）载体组件
- Patent Title: Integrated circuit (IC) carrier assembly with first and second suspension means
- Patent Title (中): 具有第一和第二悬挂装置的集成电路（IC）载体组件
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Application No.: US12264730Application Date: 2008-11-04
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Publication No.: US07919872B2Publication Date: 2011-04-05
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means interconnecting pairs of adjacent islands, and a second resilient suspension means connecting the islands adjacent to the receiving zone with the receiving zone.
Public/Granted literature
- US20090056986A1 INTEGRATED CIRCUIT (IC) CARRIER ASSEMBLY WITH FIRST AND SECOND SUSPENSION MEANS Public/Granted day:2009-03-05
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