A film-forming nozzle is moved so that a boundary portion of a plurality of areas on which a piezoelectric material layer is formed by a film-forming nozzle moving relative to a vibration plate is positioned outside deformable portions of the vibration plate and overlaps with restricted portions. This reduces stress concentration on a portion of the piezoelectric layer corresponding to the boundary portion of the deposition areas, and therefore, damage of the piezoelectric material layer is prevented.