Invention Grant
- Patent Title: Circuit module
- Patent Title (中): 电路模块
-
Application No.: US12227734Application Date: 2007-06-13
-
Publication No.: US07919907B2Publication Date: 2011-04-05
- Inventor: Ralf Reichenbach , Marian Keck
- Applicant: Ralf Reichenbach , Marian Keck
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102006037693 20060811; DE102007006994 20070214
- International Application: PCT/EP2007/055807 WO 20070613
- International Announcement: WO2008/017533 WO 20080214
- Main IPC: H01L41/113
- IPC: H01L41/113

Abstract:
A circuit module, e.g., for use in a vehicle tire, includes a housing, a piezoelectric generator, which has a mass element that is movable within the housing and a spring device, which has at least one piezoelectric element, the mass element and the spring device forming an oscillatory system, and the piezoelectric element being elastically deformable in response to the oscillation of the oscillatory system. A current supply circuit is provided for receiving a piezoelectric voltage output by the piezoelectric element in response to the mechanical deformation thereof and for supplying power to the circuit module.
Public/Granted literature
- US20090206703A1 Circuit Module Public/Granted day:2009-08-20
Information query
IPC分类: