Invention Grant
- Patent Title: Integrated substrate transfer module
- Patent Title (中): 集成基板传输模块
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Application No.: US12016834Application Date: 2008-01-18
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Publication No.: US07919972B2Publication Date: 2011-04-05
- Inventor: Shinichi Kurita , Emanuel Beer , Hung T. Nguyen , Benjamin Johnston , Fayez E. Abboud
- Applicant: Shinichi Kurita , Emanuel Beer , Hung T. Nguyen , Benjamin Johnston , Fayez E. Abboud
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: G01R13/00
- IPC: G01R13/00 ; G01R31/02

Abstract:
A system and method for supporting and transferring a substrate relative to a plurality of testing columns are provided. The system includes a testing table adapted to support and move the substrate relative to the plurality of testing columns. The testing table may include an end effector disposed therein to transfer the substrate relative to an upper surface of the testing table. The method includes transferring the substrate to the testing table and moving the substrate relative to the plurality of testing columns. Signals indicative of electronic device performance are sensed to determine operability of the devices on the substrate.
Public/Granted literature
- US20080111577A1 Integrated Substrate Transfer Module Public/Granted day:2008-05-15
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