Invention Grant
- Patent Title: Planar magnetic device and power supply IC package using same
- Patent Title (中): 平面磁性器件和电源IC封装使用相同
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Application No.: US12091619Application Date: 2006-10-26
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Publication No.: US07920043B2Publication Date: 2011-04-05
- Inventor: Katsutoshi Nakagawa , Tetsuo Inoue , Akira Sato
- Applicant: Katsutoshi Nakagawa , Tetsuo Inoue , Akira Sato
- Applicant Address: JP Tokyo JP Yokohama-Shi
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- Current Assignee Address: JP Tokyo JP Yokohama-Shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-313311 20051027
- International Application: PCT/JP2006/321367 WO 20061026
- International Announcement: WO2007/049692 WO 20070503
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/00 ; H01F27/24 ; H01F7/06

Abstract:
A planar magnetic device 1 includes a first magnetic layer 3 and a second magnetic layer 5 that are made of a mixture of a magnetic powder 7 and a resin, and a planar coil 4 disposed between the magnetic layers. When the planar coil 4 has an adjacent winding interval W between the potions 4c of the coil and the magnetic powder 7 has a maximum particle size L, planar magnetic device 1 satisfies the relationship W>L. In the planar magnetic device 1 having the above structure, fine magnetic powder that can produce a high inductance fills the spaces between the adjacent windings. Thus, the invention can achieve a high-performance planar magnetic device, such as a thin inductor.
Public/Granted literature
- US20090045905A1 PLANAR MAGNETIC DEVICE AND POWER SUPPLY IC PACKAGE USING SAME Public/Granted day:2009-02-19
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