Invention Grant
- Patent Title: Appliance assembly with thermal fuse and temperature sensing device assembly
- Patent Title (中): 电器组装，带保险丝和温度检测装置
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Application No.: US12121823Application Date: 2008-05-16
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Publication No.: US07920044B2Publication Date: 2011-04-05
- Inventor: Joseph J. Scheiber , Michael S. Coverstone
- Applicant: Joseph J. Scheiber , Michael S. Coverstone
- Applicant Address: US IN Kendallville
- Assignee: Group Dekko, Inc.
- Current Assignee: Group Dekko, Inc.
- Current Assignee Address: US IN Kendallville
- Agency: Taylor IP
- Main IPC: H01H37/76
- IPC: H01H37/76
Abstract:
An appliance assembly includes an appliance and a thermal assembly. The thermal assembly includes a housing attached to the appliance, a temperature sensing device carried by the housing and electrically coupled with the appliance, and a thermal fuse carried by the housing and electrically coupled with the appliance, the thermal assembly being a modular assembly and thereby configured for being, as a single unit, attached to and detached from the appliance.
Public/Granted literature
- US20080284558A1 APPLIANCE ASSEMBLY WITH THERMAL FUSE AND TEMPERATURE SENSING DEVICE ASSEMBLY Public/Granted day:2008-11-20
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