Invention Grant
US07920274B2 Method of measuring topology of functional liquid droplet in pixel, topology measuring apparatus of functional liquid in pixel, liquid ejection apparatus, method of manufacturing electro-optical apparatus, electro-optical apparatus, and electronic apparatus
有权
像素中功能液滴的拓扑结构的测量方法,像素中功能液体的拓扑测量装置,液体喷射装置,电光装置的制造方法,电光装置和电子设备
- Patent Title: Method of measuring topology of functional liquid droplet in pixel, topology measuring apparatus of functional liquid in pixel, liquid ejection apparatus, method of manufacturing electro-optical apparatus, electro-optical apparatus, and electronic apparatus
- Patent Title (中): 像素中功能液滴的拓扑结构的测量方法,像素中功能液体的拓扑测量装置,液体喷射装置,电光装置的制造方法,电光装置和电子设备
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Application No.: US12720210Application Date: 2010-03-09
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Publication No.: US07920274B2Publication Date: 2011-04-05
- Inventor: Hirofumi Sakai , Makoto Anan
- Applicant: Hirofumi Sakai , Makoto Anan
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2007-017166 20070126
- Main IPC: G01B11/02
- IPC: G01B11/02

Abstract:
A method of measuring topology of functional liquid in a pixel, in which thickness or volume of the functional liquid in the pixel is measured by a surface topology measuring apparatus comprising: measuring surface topologies in which surface topology of the functional liquid in the pixel and surface topology of the bank are measured by the surface topology measuring apparatus, and measurement parameters regarding the surface topologies are generated; adding a bank height in which a height parameter of a height of the bank is added to the measurement parameter of a surface of the functional liquid in the pixel of the measurement parameter generated; and calculating topology in which the thickness or the volume of the functional liquid in the pixel is calculated based on the added measurement parameter of the surface of the functional liquid in the pixel and the measurement parameter of the surface of the bank.
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