Invention Grant
US07920329B2 Embedded lens for achromatic wafer-level optical module and methods of forming the same
有权
用于消色差晶片级光模块的嵌入式透镜及其形成方法
- Patent Title: Embedded lens for achromatic wafer-level optical module and methods of forming the same
- Patent Title (中): 用于消色差晶片级光模块的嵌入式透镜及其形成方法
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Application No.: US12213562Application Date: 2008-06-20
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Publication No.: US07920329B2Publication Date: 2011-04-05
- Inventor: Jeff Viens
- Applicant: Jeff Viens
- Applicant Address: KY George Town
- Assignee: Aptina Imaging Corporation
- Current Assignee: Aptina Imaging Corporation
- Current Assignee Address: KY George Town
- Main IPC: G02B27/10
- IPC: G02B27/10 ; G03B21/56 ; G03B21/60

Abstract:
A wafer-level optical lens module including one or more embedded lenses and two outer lenses on an outer side of two outermost glass wafers. The embedded lenses may be formed of air or of any material with desired refractive index and dispersion characteristics. The outer lenses may be formed of any material with desired refractive index and dispersion characteristics. This arrangement, with various lenses of the optical module having different refractive indices and dispersions, allows for the formation of a wafer-level optical lens system which corrects for chromatic aberration and astigmatism.
Public/Granted literature
- US20090316273A1 Embedded lens for achromatic wafer-level optical module and methods of forming the same Public/Granted day:2009-12-24
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