Invention Grant
- Patent Title: Board hardware device and radio frequency blind-mate connection device
- Patent Title (中): 板卡硬件设备和射频盲板连接设备
-
Application No.: US12630464Application Date: 2009-12-03
-
Publication No.: US07920389B2Publication Date: 2011-04-05
- Inventor: Chenggang Tang , Hao Li , Haitao Li , Xiaohui Shen
- Applicant: Chenggang Tang , Hao Li , Haitao Li , Xiaohui Shen
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN200710028455 20070606
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
An RF blind-mate connection device disclosed herein includes a duplexer, a power amplification circuit board, a transceiver, an RF signal connector, and a power connector. The duplexer and the transceiver are located at one end of the RF blind-mate connection device, and the transceiver is fixed on the duplexer; the power amplification circuit board is located at the other end of the RF blind-mate connection device, and the location of the power amplification circuit board corresponds to that of the duplexer; the RF signal connector is fixed on the duplexer and the power amplification circuit board; the power connector is fixed on the transceiver and the power amplification circuit board; and the RF signal connector and the power connector transmit both the power signal and the RF signal in a blind-mate way. A board hardware device is disclosed herein to transmit RF signals and power signals inside the RF module through the connector.
Public/Granted literature
- US20100073896A1 BOARD HARDWARE DEVICE AND RADIO FREQUENCY BLIND-MATE CONNECTION DEVICE Public/Granted day:2010-03-25
Information query