Invention Grant
- Patent Title: Manufacturing system and controller, controlling method, controlling system, and control program for the manufacturing system
- Patent Title (中): 制造系统和控制器,控制方法,控制系统和制造系统的控制程序
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Application No.: US12498704Application Date: 2009-07-07
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Publication No.: US07920934B2Publication Date: 2011-04-05
- Inventor: Hisashi Aruga
- Applicant: Hisashi Aruga
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2002-230286 20020807
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05D9/00

Abstract:
A manufacturing system, located at a manufacturing system site, includes a discharger for discharging a liquid material having fluidity onto a substrate, communication means for transmitting and receiving data through a communication line, and monitoring means for monitoring the state of the discharger and for outputting data obtained by the monitoring through the communication means. The communication means provides communication between the monitoring means at the manufacturing system site and a server located outside of the manufacturing system site. The monitoring means receives a control command from the server through the communication means.
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