Invention Grant
- Patent Title: Surface shape metric and method to quantify the surface shape of electronic packages
- Patent Title (中): 表面形状度量和量化电子封装表面形状的方法
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Application No.: US12045418Application Date: 2008-03-10
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Publication No.: US07920986B2Publication Date: 2011-04-05
- Inventor: Dan Vacar , David K. McElfresh , Anton Bougaev , Donald A. Kearns , Charles E. Kinney
- Applicant: Dan Vacar , David K. McElfresh , Anton Bougaev , Donald A. Kearns , Charles E. Kinney
- Applicant Address: US CA Redwood City
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Osha • Liang LLP
- Main IPC: G01B5/18
- IPC: G01B5/18 ; G01N21/86
Abstract:
A method of quantifying a shape of a surface includes measuring an elevation (z) of the surface at a plurality of locations in an x-y plane of the surface. The measurement data is fit to a series expansion in terms of one or more base functions that include a series expansion fit. A vector of shape coefficients are calculated from the series expansion fit. A vector of shape coefficients are output.
Public/Granted literature
- US20090228237A1 SURFACE SHAPE METRIC AND METHOD TO QUANTIFY THE SURFACE SHAPE OF ELECTRONIC PACKAGES Public/Granted day:2009-09-10
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