Invention Grant
- Patent Title: Device under test de-embedding
- Patent Title (中): 被测设备去嵌入
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Application No.: US12037333Application Date: 2008-02-26
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Publication No.: US07920987B2Publication Date: 2011-04-05
- Inventor: Shun-Meen Kuo , Marcel N. Tutt
- Applicant: Shun-Meen Kuo , Marcel N. Tutt
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: G21C17/00
- IPC: G21C17/00

Abstract:
A method of determining the intrinsic electrical characteristics of a device under test (DUT) includes determining a set of test measurements for a test structure including the device and determining test measurements for a number of de-embedding test structures. Based on the test measurements, DUT measurements are determined using both open-short and three-step de-embedding processes. The DUT measurements are combined to determine an imperfection error, which is used to adjust the calculations of a four-port de-embedding method. The adjusted calculations provide for a more accurate measurement of the parasitic elements in the test structure, thereby improving the determination of the intrinsic electrical characteristics of the device.
Public/Granted literature
- US20090216480A1 DEVICE UNDER TEST DE-EMBEDDING Public/Granted day:2009-08-27
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