Invention Grant
- Patent Title: Method for laying out decoupling cells and apparatus for laying out decoupling cells
- Patent Title (中): 布置去耦电池的方法和布置去耦电池的装置
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Application No.: US12078341Application Date: 2008-03-28
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Publication No.: US07921395B2Publication Date: 2011-04-05
- Inventor: Takaaki Okumura
- Applicant: Takaaki Okumura
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2007-090496 20070330
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method for laying out decoupling cells in a semiconductor integrated circuit including a plurality of paths. The method includes extracting from a timing analysis result a timing slack amount as a timing margin for power supply noise in one of the paths serving as a target path, converting the extracted timing margin to a noise tolerance amount, comparing the noise tolerance amount and a power supply noise amount of the target path, and determining whether or not a decoupling cell must be additionally laid out in the target path based on the comparison result.
Public/Granted literature
- US20080244488A1 Method for laying out decoupling cells and apparatus for laying out decoupling cells Public/Granted day:2008-10-02
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