Invention Grant
- Patent Title: Method for manufacturing a medical electrical lead connector ring
- Patent Title (中): 医用电连接器环的制造方法
-
Application No.: US11945122Application Date: 2007-11-26
-
Publication No.: US07921554B2Publication Date: 2011-04-12
- Inventor: Thomas C. Bischoff , James M. Iknayan , Paul M. Becker , Mary L. Cole , Jordon D. Honeck
- Applicant: Thomas C. Bischoff , James M. Iknayan , Paul M. Becker , Mary L. Cole , Jordon D. Honeck
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: H05R43/04
- IPC: H05R43/04

Abstract:
A method of manufacturing a medical electrical device is presented. An inner diameter and an outer diameter of a connector ring is machined to form a first and a second flange extending from the inner diameter. An electric discharge machining wire burner is used to form a conductor channel in the inner diameter of the connector ring. A conductor is positioned within the conductor channel. A first distal end of the first flange is coupled to a second distal end of the second flange.
Public/Granted literature
- US20080148550A1 MEDICAL ELECTRICAL LEAD CONNECTOR RING Public/Granted day:2008-06-26
Information query