Invention Grant
- Patent Title: Topping cycle for a sub-ambient cooling system
- Patent Title (中): 环境冷却系统的顶部循环
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Application No.: US11859591Application Date: 2007-09-21
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Publication No.: US07921655B2Publication Date: 2011-04-12
- Inventor: William G. Wyatt , James F. Kviatkofsky , James A. Pruett , Timothy E. Adams , Christopher Moshenrose
- Applicant: William G. Wyatt , James F. Kviatkofsky , James A. Pruett , Timothy E. Adams , Christopher Moshenrose
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Baker Botts L.L.P.
- Main IPC: F25B21/02
- IPC: F25B21/02 ; F25B41/00 ; F25B49/00

Abstract:
According to one embodiment of the disclosure, a cooling system for a heat-generating structure comprises a heat exchanger, a first structure, a condenser heat exchanger, and a second condenser. The heat exchanger is in thermal communication with a heat-generating structure. The heat exchanger has an inlet and an outlet. The inlet is operable to receive fluid coolant substantially in the form of a liquid into the heat exchanger, and the outlet is operable to dispense fluid coolant at least partially in the form of a vapor out of the heat exchanger. The first structure directs a flow of the fluid coolant substantially in the form of a liquid to the heat exchanger. Thermal energy communicated from the heat-generating structure to the fluid coolant causes the fluid coolant substantially in the form of a liquid to boil and vaporize in the heat exchanger. The condenser heat exchanger receives a flow of the fluid coolant at least partially in the form of a vapor from the heat exchanger and transfers at least a portion of the thermal energy within the fluid coolant to a heat sink. The second condenser assists the condenser heat exchanger in transferring at least a portion of the thermal energy within the fluid coolant away from the fluid coolant. The second condenser is selectively activated when the heat sink reaches an undesirable temperature.
Public/Granted literature
- US20090077981A1 Topping Cycle for a Sub-Ambient Cooling System Public/Granted day:2009-03-26
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