A thermal module for LED includes a base in direct contact with an LED module; a first radiating fin assembly consisting of a plurality of parallelly spaced radiating fins and being connected at one side to the base opposite to the LED module; at least one second radiating fin assembly consisting of a plurality of parallelly spaced radiating fins, so that an air passage is provided between any two adjacent radiating fins of the second radiating fin assembly; and at least one heat pipe having a conducting section extended through and closely bearing against an interface between the base and the first radiating fin assembly, and at least one radiating section outward extended from an end of the conducting section to extend through the second radiating fin assembly. The second radiating fin assembly and the air passages thereof largely upgrade the heat dissipating efficiency of the thermal module.