Invention Grant
- Patent Title: Guide wire
- Patent Title (中): 导丝
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Application No.: US10635712Application Date: 2003-08-07
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Publication No.: US07922673B2Publication Date: 2011-04-12
- Inventor: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
- Applicant: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
- Applicant Address: JP Shibuya-Ku, Tokyo
- Assignee: Terumo Kabushiki Kaisha
- Current Assignee: Terumo Kabushiki Kaisha
- Current Assignee Address: JP Shibuya-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2002-244316 20020823; JP2002-355907 20021206; JP2003-156010 20030530
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61M25/00

Abstract:
A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side from the first wire. The first wire and the second wire are joined to each other by welding. A welded portion formed by welding has a projection projecting in the outer peripheral direction. The height of the projection may be in a range of 0.001 to 0.3 mm. The first wire may be made from a superelastic alloy, and the second wire be made from a stainless steel. The first wire and the second wire are welded to each other by a butt resistance welding process. Such a guide wire has a high joining strength between the first wire and the second wire, to thereby improve the operationality.
Public/Granted literature
- US20040039309A1 Guide wire Public/Granted day:2004-02-26
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