Invention Grant
- Patent Title: Fabrication of composite materials using atomic layer deposition
- Patent Title (中): 使用原子层沉积制备复合材料
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Application No.: US12030044Application Date: 2008-02-12
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Publication No.: US07923068B2Publication Date: 2011-04-12
- Inventor: Eric R. Dickey , William A. Barrow
- Applicant: Eric R. Dickey , William A. Barrow
- Applicant Address: US OR Beaverton
- Assignee: Lotus Applied Technology, LLC
- Current Assignee: Lotus Applied Technology, LLC
- Current Assignee Address: US OR Beaverton
- Agency: Stoel Rives LLP
- Main IPC: B32B5/22
- IPC: B32B5/22 ; C23F1/00

Abstract:
Methods of constructing composite films including particles embedded in a filler matrix involve preparing a collection of stacked particles, then depositing a matrix material throughout the particle collection using an atomic layer deposition (ALD) method so as to substantially completely fill the spaces between the particles with the matrix material. During matrix deposition, a vapor phase etch cycle may be periodically employed to avoid clogging of small pores in the particle collection. New composite materials formed by such methods are also disclosed.
Public/Granted literature
- US20080193739A1 FABRICATION OF COMPOSITE MATERIALS USING ATOMIC LAYER DEPOSITION Public/Granted day:2008-08-14
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