Invention Grant
- Patent Title: Positive resist composition and patterning process using the same
- Patent Title (中): 正抗蚀剂组合物和使用其的图案化工艺
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Application No.: US12320266Application Date: 2009-01-22
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Publication No.: US07923195B2Publication Date: 2011-04-12
- Inventor: Jun Hatakeyama , Takanobu Takeda
- Applicant: Jun Hatakeyama , Takanobu Takeda
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-029530 20080208
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30
Abstract:
The present invention provides a polymer suitable as a base resin for a positive resist composition, especially for a chemically amplified positive resist composition, having a high sensitivity, a high degree of resolution, a good pattern configuration after exposure, and in addition an excellent etching resistance; a positive resist composition using the polymer; and a patterning process.The positive resist composition of the present invention is characterized in that it contains at least, as a base resin, a polymer whose hydrogen atom of a phenolic hydroxide group is substituted by an acid labile group represented by the following general formula (1).
Public/Granted literature
- US20090202947A1 Positive resist composition and patterning process using the same Public/Granted day:2009-08-13
Information query
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