- Patent Title: Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package
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Application No.: US12960886Application Date: 2010-12-06
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Publication No.: US07923277B1Publication Date: 2011-04-12
- Inventor: Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
- Applicant: Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/15 ; H01L29/26 ; H01L51/00
Abstract:
The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
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