Invention Grant
- Patent Title: Thin film transistor substrate having transparent conductive metal and method of manufacturing the same
- Patent Title (中): 具有透明导电金属的薄膜晶体管基板及其制造方法
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Application No.: US12001031Application Date: 2007-12-06
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Publication No.: US07923287B2Publication Date: 2011-04-12
- Inventor: Eun-Guk Lee , Do-Hyun Kim , Chang-Oh Jeong , Je-Hun Lee , Soon-Kwon Lim
- Applicant: Eun-Guk Lee , Do-Hyun Kim , Chang-Oh Jeong , Je-Hun Lee , Soon-Kwon Lim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Innovation Counsel LLP
- Priority: KR10-2006-0127671 20061214
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L29/786

Abstract:
A thin film transistor substrate and a method of manufacturing the same are disclosed. The method of manufacturing a thin film transistor substrate includes forming a first conductive pattern group including a gate line, a gate electrode, and a lower gate pad electrode on a substrate, forming a gate insulating layer on the substrate on which the first conductive pattern group is formed, forming an oxide semiconductor pattern overlapping the gate electrode on the gate insulating layer, and forming first and second conductive layers on the substrate on which the oxide semiconductor pattern is formed and patterning the first and second conductive layers to form a second conductive pattern group including a data line, a source electrode, a drain electrode, and a data pad.
Public/Granted literature
- US20080142797A1 Thin film transistor, thin film transistor substate, and method of manufacturing the same Public/Granted day:2008-06-19
Information query
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