Invention Grant
- Patent Title: Method of forming a capacitor
- Patent Title (中): 形成电容器的方法
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Application No.: US11234328Application Date: 2005-09-23
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Publication No.: US07923322B2Publication Date: 2011-04-12
- Inventor: Michael Nuttall , Er-Xuan Ping , Yongjun Jeff Hu
- Applicant: Michael Nuttall , Er-Xuan Ping , Yongjun Jeff Hu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/8242
- IPC: H01L21/8242

Abstract:
A method of forming a capacitor includes forming a first capacitor electrode over a substrate. A substantially crystalline capacitor dielectric layer is formed over the first capacitor electrode. The substrate with the substantially crystalline capacitor dielectric layer is provided within a chemical vapor deposition reactor. Such substrate has an exposed substantially amorphous material. A gaseous precursor comprising silicon is fed to the chemical vapor deposition reactor under conditions effective to substantially selectively deposit polysilicon on the substantially crystalline capacitor dielectric layer relative to the exposed substantially amorphous material, and the polysilicon is formed into a second capacitor electrode.
Public/Granted literature
- US20060019442A1 Method of forming a capacitor Public/Granted day:2006-01-26
Information query
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