Invention Grant
- Patent Title: Thermal treatment equipment and method for heat-treating
- Patent Title (中): 热处理设备及热处理方法
-
Application No.: US11371273Application Date: 2006-03-08
-
Publication No.: US07923352B2Publication Date: 2011-04-12
- Inventor: Shunpei Yamazaki
- Applicant: Shunpei Yamazaki
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2001-167422 20010601
- Main IPC: H01L21/322
- IPC: H01L21/322

Abstract:
The invention provides a method for activating impurity element added to a semiconductor and performing gettering process in shirt time, and a thermal treatment equipment enabling to perform such the heat-treating. The thermal treatment equipment comprises treatment rooms of n pieces (n>2) performing heat-treating, a preparatory heating room, and a cooling room, and heating a substrate using gas heated by heating units of n pieces as a heating source, wherein a gas-supplying unit is connected to a gas charge port of the cooling room, a discharge port of the cooling room is connected to a first gas-heating unit through a heat exchanger, a charge port of an m-th (1≦m≦(n−1)) treatment room is connected to a discharge port of an m-th gas-heating unit, a charge port of an n-th treatment room is connected to a discharge port of an n-th gas-heating unit, a discharge port of the n-th treatment room is connected to the heat exchanger, and discharge port of the heat exchanger is connected to gas charge port of the preparatory heating room.
Public/Granted literature
- US20060160333A1 Thermal treatment equipment and method for heat-treating Public/Granted day:2006-07-20
Information query
IPC分类: