Invention Grant
- Patent Title: Method for forming poly-silicon film
- Patent Title (中): 多晶硅膜的形成方法
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Application No.: US12285574Application Date: 2008-10-08
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Publication No.: US07923357B2Publication Date: 2011-04-12
- Inventor: Mitsuhiro Okada , Takahiro Miyahara , Toshiharu Nishimura
- Applicant: Mitsuhiro Okada , Takahiro Miyahara , Toshiharu Nishimura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2007-266558 20071012
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/04

Abstract:
A poly-silicon film formation method for forming a poly-silicon film doped with phosphorous or boron includes heating a target substrate placed in a vacuum atmosphere inside a reaction container, and supplying into the reaction container a silicon film formation gas, a doping gas for doping a film with phosphorous or boron, and a grain size adjusting gas containing a component to retard columnar crystal formation from a poly-silicon crystal and to promote miniaturization of the poly-silicon crystal, thereby depositing a silicon film doped with phosphorous or boron on the target substrate.
Public/Granted literature
- US20090124077A1 Method for forming poly-silicon film Public/Granted day:2009-05-14
Information query
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