Invention Grant
- Patent Title: Reduction of sheet resistance of phosphorus implanted poly-silicon
- Patent Title (中): 磷植入多晶硅的薄层电阻降低
-
Application No.: US11576344Application Date: 2005-09-28
-
Publication No.: US07923359B1Publication Date: 2011-04-12
- Inventor: Wolfgang Euen , Stephan Gross
- Applicant: Wolfgang Euen , Stephan Gross
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- International Application: PCT/IB2005/053208 WO 20050928
- International Announcement: WO2006/035411 WO 20060406
- Main IPC: H01L21/425
- IPC: H01L21/425

Abstract:
There is a process for reducing the sheet resistance of phosphorus-implanted poly-silicon. In an example embodiment, there is an MOS transistor structure. The structure has a gate region, drain region and a source region. A method for reducing the sheet resistance of the gate region comprises depositing intrinsic amorphous silicon at a predetermined temperature onto the gate region. An amorphizing species is implanted into the intrinsic amorphous silicon. Phosphorus species are then implanted into the gate region of the MOS transistor structure. A feature of this embodiment includes using Ar+ as the amorphizing species.
Public/Granted literature
- US20110097883A1 REDUCTION OF SHEET RESISTANCE OF PHOSPHORUS IMPLANTED POLY-SILICON Public/Granted day:2011-04-28
Information query
IPC分类: