Invention Grant
US07923359B1 Reduction of sheet resistance of phosphorus implanted poly-silicon 有权
磷植入多晶硅的薄层电阻降低

  • Patent Title: Reduction of sheet resistance of phosphorus implanted poly-silicon
  • Patent Title (中): 磷植入多晶硅的薄层电阻降低
  • Application No.: US11576344
    Application Date: 2005-09-28
  • Publication No.: US07923359B1
    Publication Date: 2011-04-12
  • Inventor: Wolfgang EuenStephan Gross
  • Applicant: Wolfgang EuenStephan Gross
  • Applicant Address: NL Eindhoven
  • Assignee: NXP B.V.
  • Current Assignee: NXP B.V.
  • Current Assignee Address: NL Eindhoven
  • International Application: PCT/IB2005/053208 WO 20050928
  • International Announcement: WO2006/035411 WO 20060406
  • Main IPC: H01L21/425
  • IPC: H01L21/425
Reduction of sheet resistance of phosphorus implanted poly-silicon
Abstract:
There is a process for reducing the sheet resistance of phosphorus-implanted poly-silicon. In an example embodiment, there is an MOS transistor structure. The structure has a gate region, drain region and a source region. A method for reducing the sheet resistance of the gate region comprises depositing intrinsic amorphous silicon at a predetermined temperature onto the gate region. An amorphizing species is implanted into the intrinsic amorphous silicon. Phosphorus species are then implanted into the gate region of the MOS transistor structure. A feature of this embodiment includes using Ar+ as the amorphizing species.
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