Invention Grant
- Patent Title: Dip-forming composition and dip-formed article
- Patent Title (中): 浸渍成型组合物和浸渍成型制品
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Application No.: US10578430Application Date: 2004-11-18
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Publication No.: US07923515B2Publication Date: 2011-04-12
- Inventor: Kazumi Kodama , Kenji Arai , Tomomi Onitake , Hisanori Ota
- Applicant: Kazumi Kodama , Kenji Arai , Tomomi Onitake , Hisanori Ota
- Applicant Address: JP Tokyo
- Assignee: Zeon Corporation
- Current Assignee: Zeon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2003-391914 20031121; JP2004-079607 20040319
- International Application: PCT/JP2004/017147 WO 20041118
- International Announcement: WO2005/049725 WO 20050602
- Main IPC: C08C19/00
- IPC: C08C19/00 ; C08C19/04

Abstract:
A dip-formed article that has wearing comfort, excelling in not only tensile strength but also flexing fatigue and that itself does not tend to suffer coloration even when the article is worn and operation is continued; and a dip-forming composition capable of providing such a dip-formed article. There is provided a dip-forming composition comprising a conjugated diene rubber latex and an organic peroxide, wherein providing that X refers to the 10-hr half-life temperature (° C.) of organic peroxide and Y refers to the octanol-water partition coefficient of organic peroxide, the organic peroxide satisfies the formulae: 11≧Y≧2 (1), and 100−2Y≧X≧70−2Y (2). There is further provided a dip-formed article obtained from the composition.
Public/Granted literature
- US20070082152A1 DIP FORMING COMPOSITION AND DIP FORMED ARTICLE Public/Granted day:2007-04-12
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