Invention Grant
- Patent Title: Key switch sheet and key switch module
- Patent Title (中): 钥匙开关板和钥匙开关模块
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Application No.: US12402176Application Date: 2009-03-11
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Publication No.: US07923653B2Publication Date: 2011-04-12
- Inventor: Yoshimasa Ohsumi
- Applicant: Yoshimasa Ohsumi
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Osha Liang LLP
- Priority: JP2008-085763 20080328
- Main IPC: H01H1/10
- IPC: H01H1/10

Abstract:
A key switch sheet has a pressure sensitive adhesive layer for holding a contact spring by adhering to an apex portion of a dome-shaped contact spring at a back surface of a base material sheet. A thickness of the pressure sensitive adhesive layer at a region to be made to adhere to the apex portion of the contact spring is thicker than a thickness of the pressure sensitive adhesive layer at a peripheral region and thicker than or equal to a thickness of the pressure sensitive adhesive layer at a region where the base material sheet is made to adhere to a substrate.
Public/Granted literature
- US20090242374A1 KEY SWITCH SHEET AND KEY SWITCH MODULE Public/Granted day:2009-10-01
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