Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12517479Application Date: 2007-12-07
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Publication No.: US07923771B2Publication Date: 2011-04-12
- Inventor: Nobuki Miyakoshi
- Applicant: Nobuki Miyakoshi
- Applicant Address: JP Tokyo
- Assignee: Shindengen Electric Manufacturing Co., Ltd.
- Current Assignee: Shindengen Electric Manufacturing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- Priority: JPP2006-330270 20061207
- International Application: PCT/JP2007/073676 WO 20071207
- International Announcement: WO2008/069309 WO 20080612
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device (10) of the present invention includes: a drift layer (5) that includes a reference concentration layer (4) including an impurity of a first conductive type at a first reference concentration and a low concentration layer (3) provided under the reference concentration layer and including an impurity of the first conductive type at a concentration lower than the first reference concentration; a gate electrode (20) that is formed on an upper surface of the reference concentration layer; a pair of source regions (Sa and 8b) that are respectively provided on the reference concentration layer in the vicinity of ends of the gate electrode and include an impurity of the first conductive type at a concentration higher than the first reference concentration.
Public/Granted literature
- US20100013007A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-01-21
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