Invention Grant
US07923773B2 Semiconductor device, manufacturing method thereof, and data processing system
有权
半导体装置及其制造方法以及数据处理系统
- Patent Title: Semiconductor device, manufacturing method thereof, and data processing system
- Patent Title (中): 半导体装置及其制造方法以及数据处理系统
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Application No.: US12255817Application Date: 2008-10-22
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Publication No.: US07923773B2Publication Date: 2011-04-12
- Inventor: Hiroshi Kujirai
- Applicant: Hiroshi Kujirai
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2007-275691 20071023
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/3205

Abstract:
A bottom of a gate trench has a first bottom relatively far from an STI and a second bottom relatively near from the STI. A portion, in an active region, configuring the second bottom of the gate trench configures a side-wall channel region, and has a thin-film SOI structure sandwiched between the gate electrode and the STI. On the other hand, a portion configuring the first bottom of the gate trench functions as a sub-channel region. A curvature radius of the second bottom is larger than a curvature radius of the first bottom. In an approximate center in a length direction of the gate trench, a bottom of a trench is approximately flat, and on the other hand, in ends of the length direction, a nearly whole bottom of the trench is curved.
Public/Granted literature
- US20090101971A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND DATA PROCESSING SYSTEM Public/Granted day:2009-04-23
Information query
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