Invention Grant
- Patent Title: Micromechanical component having thin-layer encapsulation and production method
- Patent Title (中): 微机械部件具有薄层封装和制造方法
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Application No.: US12152332Application Date: 2008-05-13
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Publication No.: US07923794B2Publication Date: 2011-04-12
- Inventor: Ando Feyh
- Applicant: Ando Feyh
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007022509 20070514
- Main IPC: H01L29/82
- IPC: H01L29/82

Abstract:
A micromechanical component having a substrate and having a thin-layer, as well as having a cavity which is bounded by the substrate and the thin-layer, at least one gas having an internal pressure being enclosed in the cavity. The gas phase has a non-atmospheric composition. A method for producing a micromechanical component having a substrate and having a thin-layer encapsulation, as well as having a cavity which is bounded by the substrate and the thin-layer encapsulation. The method has the steps of positioning a polymer in a cavity, closing the cavity and generating a gas phase of non-atmospheric composition in the cavity by decomposing at least a part of the polymer. An internal pressure is generated, which may be higher than the process pressure when the cavity is closed.
Public/Granted literature
- US20080296747A1 Micromechanical component having thin-layer encapsulation and production method Public/Granted day:2008-12-04
Information query
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