Invention Grant
US07923794B2 Micromechanical component having thin-layer encapsulation and production method 有权
微机械部件具有薄层封装和制造方法

  • Patent Title: Micromechanical component having thin-layer encapsulation and production method
  • Patent Title (中): 微机械部件具有薄层封装和制造方法
  • Application No.: US12152332
    Application Date: 2008-05-13
  • Publication No.: US07923794B2
    Publication Date: 2011-04-12
  • Inventor: Ando Feyh
  • Applicant: Ando Feyh
  • Applicant Address: DE Stuttgart
  • Assignee: Robert Bosch GmbH
  • Current Assignee: Robert Bosch GmbH
  • Current Assignee Address: DE Stuttgart
  • Agency: Kenyon & Kenyon LLP
  • Priority: DE102007022509 20070514
  • Main IPC: H01L29/82
  • IPC: H01L29/82
Micromechanical component having thin-layer encapsulation and production method
Abstract:
A micromechanical component having a substrate and having a thin-layer, as well as having a cavity which is bounded by the substrate and the thin-layer, at least one gas having an internal pressure being enclosed in the cavity. The gas phase has a non-atmospheric composition. A method for producing a micromechanical component having a substrate and having a thin-layer encapsulation, as well as having a cavity which is bounded by the substrate and the thin-layer encapsulation. The method has the steps of positioning a polymer in a cavity, closing the cavity and generating a gas phase of non-atmospheric composition in the cavity by decomposing at least a part of the polymer. An internal pressure is generated, which may be higher than the process pressure when the cavity is closed.
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