Invention Grant
- Patent Title: Integrated circuit package system including shield
- Patent Title (中): 集成电路封装系统包括屏蔽
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Application No.: US12762602Application Date: 2010-04-19
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Publication No.: US07923822B2Publication Date: 2011-04-12
- Inventor: Marcos Karnezos
- Applicant: Marcos Karnezos
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/556
- IPC: H01L23/556
Abstract:
An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.
Public/Granted literature
- US20100200967A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD Public/Granted day:2010-08-12
Information query
IPC分类:
