Invention Grant
US07923835B2 Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
有权
封装，电子器件，具有分离区域和布线层的衬底，以及制造方法
- Patent Title: Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
- Patent Title (中): 封装，电子器件，具有分离区域和布线层的衬底，以及制造方法
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Application No.: US12018263Application Date: 2008-01-23
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Publication No.: US07923835B2Publication Date: 2011-04-12
- Inventor: Yoshihiro Kubota , Shirou Youda , Kazuto Tsuji
- Applicant: Yoshihiro Kubota , Shirou Youda , Kazuto Tsuji
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-013159 20070123
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.
Public/Granted literature
- US20080174005A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2008-07-24
Information query
IPC分类:
