Invention Grant
US07923849B2 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
有权
使用无铅焊料并具有反应阻挡层的倒装芯片的互连
- Patent Title: Interconnections for flip-chip using lead-free solders and having reaction barrier layers
- Patent Title (中): 使用无铅焊料并具有反应阻挡层的倒装芯片的互连
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Application No.: US12113152Application Date: 2008-04-30
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Publication No.: US07923849B2Publication Date: 2011-04-12
- Inventor: Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
- Applicant: Keith E. Fogel , Balaram Ghosal , Sung K. Kang , Stephen Kilpatrick , Paul A. Lauro , Henry A. Nye, III , Da-Yuan Shih , Donna S. Zupanski-Nielsen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Daniel P. Morris; David Aker
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
Public/Granted literature
- US20080206979A1 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS Public/Granted day:2008-08-28
Information query
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