Invention Grant
- Patent Title: Sonic fine-hole forming apparatus
- Patent Title (中): 声波微孔成型装置
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Application No.: US11988188Application Date: 2005-07-04
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Publication No.: US07923897B2Publication Date: 2011-04-12
- Inventor: Shunro Tachibana , Katsuro Tachibana
- Applicant: Shunro Tachibana , Katsuro Tachibana
- Applicant Address: JP Fukuoka
- Assignee: Sonopore, Ltd.
- Current Assignee: Sonopore, Ltd.
- Current Assignee Address: JP Fukuoka
- Agency: Jordan and Hamburg LLP
- International Application: PCT/JP2005/012357 WO 20050704
- International Announcement: WO2007/004287 WO 20070111
- Main IPC: H01L41/00
- IPC: H01L41/00 ; A61N1/30

Abstract:
Disclosed is a sonic fine-hole forming apparatus for forming a fine-hole in a surface of a membrane or solid body in a liquid by means of sonic energy. The sonic fine-hole forming apparatus is adapted to generate a sonic oscillation driving signal comprises a voltage waveform which has positive and negative voltage portions being asymmetrical, and a sharp peak portion. The sonic fine-hole forming apparatus includes a sonic oscillation section having a surface provided with a covering layer or a protective material having an electrically insulating property and a sonic transparency. The coated layer or a protective material is formed to have a thickness of 10 μm or more. The sonic fine-hole forming apparatus of the present invention can form a fine-hole in a surface of a solid body without using a large-scale apparatus, while suppressing a destructive action around the fine-hole.
Public/Granted literature
- US20090127973A1 Sonic fine-hole forming apparatus Public/Granted day:2009-05-21
Information query
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