Invention Grant
- Patent Title: Wafer holder
- Patent Title (中): 晶圆架
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Application No.: US12288284Application Date: 2008-10-17
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Publication No.: US07923990B2Publication Date: 2011-04-12
- Inventor: Yo Itakura
- Applicant: Yo Itakura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha TOPCON
- Current Assignee: Kabushiki Kaisha TOPCON
- Current Assignee Address: JP Tokyo
- Agency: Chapman and Cutler LLP
- Priority: JP2007-277162 20071025
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A wafer holder is provided which includes a holder body with a chuck table having a ring-like wafer receptacle, and a plurality of fixing portions fixing a wafer on the wafer receptacle to hold the wafer, and a carrier supporting the wafer before fixed on the wafer receptacle from downward. The holder body includes a carrier support portion which forms a support face to support the carrier and be changeable in height from an original position, and positions the support face on which the wafer is placed at a delivery position. The carrier support portion separates the wafer from the carrier by lowering the support face from the delivery position, so that the fixing portions fix the wafer.
Public/Granted literature
- US20090110521A1 Wafer holder Public/Granted day:2009-04-30
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