Invention Grant
US07924097B2 Solid-state ultra-wideband microwave power amplifier employing modular non-uniform distributed amplifier elements
有权
采用模块化非均匀分布式放大器元件的固态超宽带微波功率放大器
- Patent Title: Solid-state ultra-wideband microwave power amplifier employing modular non-uniform distributed amplifier elements
- Patent Title (中): 采用模块化非均匀分布式放大器元件的固态超宽带微波功率放大器
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Application No.: US11629025Application Date: 2005-11-01
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Publication No.: US07924097B2Publication Date: 2011-04-12
- Inventor: Robert J. Lender, Jr. , Robert Actis
- Applicant: Robert J. Lender, Jr. , Robert Actis
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agent Daniel J. Long; Robert K. Tendler
- International Application: PCT/US2005/039407 WO 20051101
- International Announcement: WO2006/057774 WO 20060601
- Main IPC: H03F3/60
- IPC: H03F3/60

Abstract:
A number of identical non-uniformly distributed ultra-wideband power amplifier string building blocks are coupled together to form an ultra-wide bandwidth high-power amplifier. The non-uniform distribution results in an amplifier utilizing modular string building blocks that have input and output impedances with only real values. This permits the strings to be replicated and connected together with simple impedance matching. The internal impedance matching associated with the non-linear distribution also absorbs parasitic capacitance to permit the ultra-broadband operation. In one embodiment identical transistors are used for each cell so that the strings may be identically replicated. This permits modular re-use without reconfiguration. In one embodiment a non-uniform distributed power amplifier built using the subject building blocks provides an ultra-wideband multi-octave device suitable for electronic warfare and communications applications, especially to replace traveling wave tubes.
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