Invention Grant
- Patent Title: Collapsible contact switch
- Patent Title (中): 可折叠接触开关
-
Application No.: US12497889Application Date: 2009-07-06
-
Publication No.: US07924122B2Publication Date: 2011-04-12
- Inventor: Tsung-Kuan Allen Chou , Hanan Bar
- Applicant: Tsung-Kuan Allen Chou , Hanan Bar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Pearl Cohen Zedek Latzer, LLP
- Main IPC: H01H51/22
- IPC: H01H51/22
Abstract:
Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.
Public/Granted literature
- US20090266688A1 COLLAPSIBLE CONTACT SWITCH Public/Granted day:2009-10-29
Information query
