Invention Grant
- Patent Title: Electronic module, methods of manufacturing and driving the same, and electronic instrument
- Patent Title (中): 电子模块，制造和驱动方法以及电子仪器
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Application No.: US12000167Application Date: 2007-12-10
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Publication No.: US07924275B2Publication Date: 2011-04-12
- Inventor: Takaaki Hayashi
- Applicant: Takaaki Hayashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-253544 20020830; JP2002-262923 20020909; JP2002-266832 20020912; JP2003-275430 20030716
- Main IPC: G06F3/038
- IPC: G06F3/038
Abstract:
An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
Public/Granted literature
- US20080106209A1 Electric module, methods of manufacturing and driving the same, and electronic instrument Public/Granted day:2008-05-08
Information query
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