Invention Grant
- Patent Title: Coating/developing apparatus and pattern forming method
- Patent Title (中): 涂布/显影装置和图案形成方法
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Application No.: US11958798Application Date: 2007-12-18
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Publication No.: US07924396B2Publication Date: 2011-04-12
- Inventor: Hisashi Kawano , Junichi Kitano , Hitoshi Kosugi , Koichi Hontake , Masashi Enomoto
- Applicant: Hisashi Kawano , Junichi Kitano , Hitoshi Kosugi , Koichi Hontake , Masashi Enomoto
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-339567 20061218
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03B5/00

Abstract:
A coating/developing apparatus includes a process section including processing units to perform a series of processes for resist coating and development; an interface section disposed between the process section and immersion light exposure apparatus; and a drying section disposed in the interface section to dry the substrate immediately after the immersion light exposure process. The drying section includes a process container configured to accommodate the substrate, a substrate support member configured to place the substrate thereon, a temperature-adjusted gas supply mechanism configured to supply a temperature-adjusted gas into the process container, and an exhaust mechanism configured to exhaust the process container. The drying section is arranged to dry the substrate by supplying the temperature-adjusted gas into the process container with the substrate placed on the substrate support member, while exhausting the process container.
Public/Granted literature
- US20080204675A1 COATING/DEVELOPING APPARATUS AND PATTERN FORMING METHOD Public/Granted day:2008-08-28
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